Sigtech Wireless Technologies interview questions

3 rounds of interview, Firstly aptitude test consisting of c , respective branch in btech based questions.2nd round is technical round. Interviewer is a friendly person, asks good and correct level of questions as per the job role applied for. Linked list, OSI layers, c programming are the main questions, 1 logic question, storage class in c , about project, why should company hire you, personal brief intro.

There was an aptitude/technical written test followed by three round face to face interview. Aptitude/technical test cover the basic technical questins from communication engg., DSP, Microcontroller and C. There were total of 30 questins and one hour time. 27 technical questin and 3 aptitude questins. After passing the test candidate should be guided for the first round technical face to face interview. Which basicaly deals about c questions from pointer, array, arithemetic operators, storage class, bitwise operators. Firstly they asked about our project then go for the C questins. Linked list is also a poit of concern. Difference between C and Embedded C. After clearing the round go for the second round F2F interview. This round also based on C questions. Some question regarding our project and how we develop the project and so on. Checking with our resume and asked some questions randomly based on embedded system. Difference between SPI and I2C. Working of interrupt. Interrupt programming. Multiple interrupt concept. Interrupt vector table. Lastly HR interview, in this section they ask our expected package, some bond has been requested, some aptitude questions.