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As of June 2026, Micron Technology employees rate their career opportunities with 3.8 out of 5 stars, according to 8,832 anonymously submitted Glassdoor reviews . This rating has increased by 1% over the last 12 months.

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Micron Technology

Micron Technology NTI Senior Process Engineer/Process Engineer jobs

683 results in Hong-Kong

Lead Staff Engineer – ATE Process DIR
Manassas, VA
US$107K - US$148K (Glassdoor Est.)
20d
Staff Foundry Interface Design Engineer- HBM - TPG
Folsom, CA
US$175K - US$297K (Employer provided)
30d+
Custom HBM Physical Design Engineer, Member of Technical Staff (MTS)
Richardson, TX
US$194K - US$347K (Employer provided)
5d

TPG Workforce Development-Onboarding
Boise, ID
US$51K - US$75K (Glassdoor Est.)
30d+
New College Grad - Design Engineer - Pathfinding Design
Folsom, CA
US$86K - US$147K (Employer provided)
30d+
Industrial Engineer
Manassas, VA
US$84K - US$118K (Glassdoor Est.)
30d+
Staff Engineer (DTPG DOS STRAT Alignment)
Boise, ID
US$52K - US$83K (Glassdoor Est.)
4d
Dry Mechanical Engineer
Clay, NY
US$89K - US$221K (Employer provided)
6d
Principal Engineer, HBM Validation Quality Management
Boise, ID
US$125K - US$168K (Glassdoor Est.)
11d
Staff HBM Design Architect
Richardson, TX
US$146K - US$297K (Employer provided)
30d+
Staff HBM Design Architect
Richardson, TX
US$146K - US$297K (Employer provided)
20d
TPG Workforce Development-Onboarding
Richardson, TX
US$54K - US$85K (Glassdoor Est.)
30d+
New College Grad - Supply Management Analyst
Manassas, VA
US$64K - US$104K (Glassdoor Est.)
30d+
Semiconductor Design Engineer
Boise, ID
US$75K - US$102K (Glassdoor Est.)
30d+
Wafer Bond Process Development Engineer
Boise, ID
US$81K - US$107K (Glassdoor Est.)
30d+
Product Development Engineer 1
Boise, ID
US$79K - US$105K (Glassdoor Est.)
30d+
PROCT ADT Equipment Staff Engineer/ Principal (Dry Etch | Deposition CVD/PVD/Diffusion | CMP | Wet)
Boise, ID
US$56K - US$90K (Glassdoor Est.)
19d
Semiconductor Process Engineer
Boise, ID
30d+
Process Engineer
Boise, ID
US$91K - US$128K (Glassdoor Est.)
20d
Member of Technical Staff, AI‑Optimized Memory Digital Design Engineer / Microarchitect
Richardson, TX
US$177K - US$309K (Employer provided)
30d+
Principal Engineer (Adv Pkg Pathfinding), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM)
Boise, ID
30d+
FAB Engineer (Wet Process)
Manassas, VA
US$80K - US$112K (Glassdoor Est.)
6d
Sr Administrative Assistant
Boise, ID
US$53K - US$73K (Glassdoor Est.)
30d+
Senior Electrical Failure Analysis Engineer- Storage systems
Longmont, CO
US$96K - US$203K (Employer provided)
30d+
Assistant General Counsel
Syracuse, NY
US$160K - US$281K (Employer provided)
30d+
Principal Compute Pathfinding ASIC Design
Boise, ID
30d+
SMTS/DMTS in Process Equipment Engineering
Boise, ID
30d+
Principal SoC Design Engineer, HBM
Richardson, TX
US$140K - US$178K (Glassdoor Est.)
30d+
PCVD Process Manager
Boise, ID
US$79K - US$118K (Glassdoor Est.)
30d+
Principal HIG ESD and Latch-up Engineer- HBM - TPG
Richardson, TX
US$175K - US$297K (Employer provided)
30d+
NY Construction Scheduling Lead
Syracuse, NY
US$128K - US$217K (Employer provided)
30d+
Process Integration Engineer
Boise, ID
US$82K - US$107K (Glassdoor Est.)
3d
Staff SSD Systems Design Engineer
Longmont, CO
US$146K - US$247K (Employer provided)
6d
New College Grad - RAM Shift Process Engineer
Manassas, VA
US$54K - US$79K (Glassdoor Est.)
13d
Staff Artificial Intelligence Enablement Partner
Boise, ID
US$80K - US$111K (Glassdoor Est.)
30d+
HBM SIPI, Principal Engineer
Richardson, TX
US$175K - US$309K (Employer provided)
30d+
Staff Engineer, GFAC US - Mech
Boise, ID
US$98K - US$136K (Glassdoor Est.)
30d+
Equipment Engineer and Process Engineer - Veterans and Transitioning Military
Boise, ID
30d+
Engineer - HIG HBM PSE - Design Validation
Richardson, TX
US$78K - US$125K (Glassdoor Est.)
30d+
New College Grad- Design Engineer, HIG HBM Design
Richardson, TX
US$72K - US$119K (Glassdoor Est.)
11d

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