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As of June 2026, Intel Corporation employees rate their career opportunities with 3.7 out of 5 stars, according to 39,296 anonymously submitted Glassdoor reviews . This rating has remained stable over the last 12 months.

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Intel Corporation

Intel Corporation Module Development Engineer jobs

222 results in Hong-Kong

Packaging Module Development Engineer
Phoenix, AZ
US$115K - US$163K (Employer provided)
11d
Packaging Module Equipment Development Engineer
Phoenix, AZ
US$134K - US$189K (Employer provided)
30d+
Packaging Module Equipment Development Engineer
Phoenix, AZ
US$115K - US$220K (Employer provided)
4d

Module Development Engineer
Hillsboro, OR
US$134K - US$255K (Employer provided)
4d
Principal Engineer, Verification
Remote
US$221K - US$312K (Employer provided)
4d
Packaging Module Development Engineer
Phoenix, AZ
US$134K - US$255K (Employer provided)
3d
Senior EDA Tools Hardware Engineer
Remote
US$164K - US$312K (Employer provided)
30d+
Design Engineer – AI SoC Development
Folsom, CA
US$164K - US$232K (Employer provided)
24h
Module Development Engineer
Hillsboro, OR
US$99K - US$189K (Employer provided)
30d+
Product Development Engineer
Hillsboro, OR
US$122K - US$232K (Employer provided)
27d
Module Development Engineer
Hillsboro, OR
US$134K - US$189K (Employer provided)
6d
Module Development Defect Inspection Engineer
Hillsboro, OR
US$115K - US$220K (Employer provided)
30d+
Module Development Engineer
Hillsboro, OR
US$156K - US$298K (Employer provided)
30d+
Middleware Development Engineer
Hillsboro, OR
US$111K - US$211K (Employer provided)
30d+
Module Development Engineer (Adv Packaging)
Hillsboro, OR
US$99K - US$140K (Employer provided)
21d
LTD Process Development Integration Engineer
Hillsboro, OR
US$99K - US$163K (Employer provided)
9d
MDM Software Application Development Engineer
Remote
US$138K - US$227K (Employer provided)
27d
Module Development Engineer
Hillsboro, OR
US$211K - US$298K (Employer provided)
30d+
Design Verification Engineer
Santa Clara, CA
US$142K - US$200K (Employer provided)
5d
Advanced Packaging Top Die Module Engineer
Albuquerque, NM
US$104K - US$171K (Employer provided)
5d
Machine Learning Engineer
Santa Clara, CA
US$171K - US$315K (Employer provided)
13d
Module Development Engineer - RF Test
Phoenix, AZ
US$115K - US$220K (Employer provided)
10d
CPU Memory Design Engineer
Austin, TX
US$122K - US$232K (Employer provided)
30d+
Intel Foundry Module Development Engineer
Hillsboro, OR
US$134K - US$255K (Employer provided)
12d
Yield Development Engineer
Phoenix, AZ
US$134K - US$189K (Employer provided)
25d
Packaging Module Development Engineer
Phoenix, AZ
US$115K - US$220K (Employer provided)
30d+
SoC Design Engineer
Austin, TX
US$122K - US$232K (Employer provided)
30d+
Intel Foundry Module Development Engineer
Hillsboro, OR
US$156K - US$220K (Employer provided)
30d+
CPU Physical Design Engineer
Austin, TX
US$142K - US$269K (Employer provided)
30d+
Intel Foundry Lithography Module Development Engineer
Hillsboro, OR
US$134K - US$189K (Employer provided)
30d+
CPU Circuit Design Engineer
Austin, TX
US$91K - US$173K (Employer provided)
30d+
Advanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)
Phoenix, AZ
US$99K - US$140K (Employer provided)
24d
SoC Logic Design Engineer
Hillsboro, OR
US$142K - US$200K (Employer provided)
3d
SoC Logic Design Engineer
Hillsboro, OR
US$142K - US$200K (Employer provided)
6d
Silicon Packaging Design Engineer
Phoenix, AZ
US$106K - US$173K (Employer provided)
16d
Design Engineer – AI SoC Development
Folsom, CA
US$164K - US$232K (Employer provided)
30d+
CPU Physical Design Engineer
Austin, TX
US$106K - US$173K (Employer provided)
30d+
CPU Physical Design Engineer
Austin, TX
US$106K - US$200K (Employer provided)
30d+
CPU Memory Design Engineer
Austin, TX
US$164K - US$269K (Employer provided)
30d+
EDA Design Flow Development Engineer
Santa Clara, CA
US$142K - US$269K (Employer provided)
17d

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